零件四边有脚,零件脚向外张开引脚封装的集成简称()
A. SOP(SmalloutlinePackage)
B. QFP(QuadFlatPackage)
C. PLCC(PlasticLeadlessChipCarrier)
D. BGA(BallGridArray)
零件四边有脚,零件脚向零件底部弯曲封装的集成简称()
A. SOP(SmalloutlinePackage)
B. QFP(QuadFlatPackage)
C. PLCC(PlasticLeadlessChipCarrier)
D. BGA(BallGridArray)
零件表面无脚,其脚成球状矩阵排列于零件底部封装的集成简称()
A. SOP(SmalloutlinePackage)
B. QFP(QuadFlatPackage)
C. PLCC(PlasticLeadlessChipCarrier)
D. BGA(BallGridArray)
鸥翼型引脚封装的集成简称()
A. SOP(Small outline Package)
B. QFP(Quad Flat Package)
C. PLCC(Plastic Leadless Chip Carrier)
D. BGA(Ball Grid Array)