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Prior to the addition of the components to a board, solder paste needs to be added to those areas of the board where solder is required. Typically these areas are the component pads. This is achieved using a solder screen.
The board with the added solder paste is then passed into the pick and place process, the pick and place machines place large numbers of small, or large components quickly and accurately onto printed circuit boards.
The pick and place machines are pre-programmed with the information about component positions so that they know where to place the components. This program is normally developed directly from the printed circuit board design information.
Soldering in the production of electronic equipment can take many forms. In the mass production of electronic equipment, automated techniques such as wave soldering, or reflow soldering are widely used. Meanwhile manual soldering is still used both in commercial and home environments.
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